California NanoSystems Institute
CNSI
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Rob Candler, Ph.D.

   
Assistant Professor, Electrical Engineering
Member, California NanoSystems Institute

Education:
Degrees:
Ph.D., Stanford University, 2006
M.S., Stanford University, 2002
B.S., Electrical Engineering, 2000

Honors and Awards:
2000 Auburn University, Most Outstanding EECS Engineering Student
2000 Auburn University, Most Outstanding Student in College of Engineering
2000 National Defense, Science and Engineering Graduate Fellowship
2000 National Science Foundation, Graduate Fellowship
2000 Stanford University, College of Engineering Fellowship

Contact Information:
Work Email Address: rcandler@ee.ucla.edu
Mailing Address: UCLA Elec Engr
BOX 951594, 6731-H BH
Los Angeles, CA 90095
UNITED STATES
Home Page: http://www.ee.ucla.edu/~rcandler/index.html
Work Phone Number: 310-825-4161
Technical Research Interest:

Nano/Microelectromechanical Systems (N/MEMS) design and sensing applications,

micro/nanoscale analysis of surface phenomena, energy harvesting, micromechanical

resonators and inertial sensors, sensors for biomedical applications, packaging of MEMS/NEMS devices.

Rob Candler’s research interests are in the design, modeling, and technology development of micro/nanosystems, fundamental limitations of N/MEMS, and the interface of microsystems with biology.

Prior to joining UCLA, Candler was a senior MEMS research engineer at Bosch Research and Technology Center in Palo Alto, California and a consulting assistant professor at Stanford University. As a senior research engineer at Bosch Research, Candler collaborated with major research universities on joint projects (bioMEMS, stiction/adhesion, & sensor drift) including leading Bosch participation in DARPA-funded project: Science andTechnology Fundamentals); Evaluated and developed technologies for future products in automobile safety (e.g., air-bag and traction control) and consumer applications (e.g., gaming and mobile phones); and was a resident engineer at SiTime, a MEMS oscillator startup company, working on research projects of common benefit to SiTime and Bosch.


Additional Information:

Professor Candler was born in 1977 in Auburn, AL. He has two brothers. Will, his older brother, is a law student at Duke University. Sam, his younger brother, is currently an undergraduate at Auburn University studying electrical engineering. Carla, his mother, is an organist, while Bill, his father, is a psychologist for the VA.

Selected Publications:

Jha, C. M. Hopcroft, M. A. Chandorkar, S. A. Salvia, J. C. Agarwal, M. Candler, R. N. Melamud, R. Kim, B. Kenny, T. W. , Thermal isolation of encapsulated MEMS resonators, Journal of Microelectromechanical Systems, 2008, 17 (1), 175-184.
M. Agarwal, S. A. Chandorkar, R. N. Candler, B. Kim, M. A. Hopcroft, R. Melamud, C. M. Jha, D. B. Leeson, T. W. Kenny, B. Murmann, A-f Effect Cancellation in Electrostatic MEMS Resonators, Applied Physics Letters, 2008, In press.
Bongsang, Kim Melamud, R. Hopcroft, M. A. Chandorkar, S. A. Bahl, G. Messana, M. Candler, R. N. Yama, G. Kenny, T. , Si-SiO/sub 2/ composite MEMS resonators in CMOS compatible wafer-scale thin-film encapsulation, 2007 IEEE International Frequency Control Symposium Jointly with the 21st European Frequency and Time Forum, 2007, 1214-1219.
Woo-Tae, Park O'Connor, K. N. Kuan-Lin, Chen Mallon, J. R., Jr. Maetani, T. Dalal, P. Candler, R. N. Ayanoor-Vitikkate, V. Roberson, J. B., Jr. Puria, S. Kenny, T. W. , Ultraminiature encapsulated accelerometers as a fully implantable sensor for implantable hearing aids, Biomedical Microdevices, 2007, 9 (6), 939-949.
M. Agarwal, K. K. Park, S. A. Chandorkar, R. N. Candler, B. Kim, M. A. Hopcroft, R. Melamud, T. W. Kenny, B. Murmann, Acceleration sensitivity in beam-type electrostatic microresonators, Applied Physics Letters, 2007, 90.
B. Kim, R. N. Candler, M. A. Hopcroft, M. Agarwal, W.-T. Park, T. W. Kenny, Frequency Stability of Wafer-scale Encapsulated Silicon Based MEMS Resonators, Sensors and Actuators, 2007, 136, 125-131 .
Park Woo-Tae, O'Connor Kevin N, Chen Kuan-Lin, Mallon Joseph R, Maetani Toshiki, Dalal Parmita, Candler Rob N, Ayanoor-Vitikkate Vipin, Roberson Joseph B, Puria Sunil, Kenny Thomas W, Ultraminiature encapsulated accelerometers as a fully implantable sensor for implantable hearing aids., Biomedical microdevices, 2007, 9 (6), 939-49.
Woo-Tae, Park Partridge, A. Candler, R. N. Ayanoor-Vitikkate, V. Yama, G. Lutz, M. Kenny, T. W. , Encapsulated submillimeter piezoresistive accelerometers, Journal of Microelectromechanical Systems, 2006, 15 (3), 507-514.
Duwel, A. Candler, R. N. Kenny, T. W. Varghese, M. , Engineering MEMS resonators with low thermoelastic damping, Journal of Microelectromechanical Systems, 2006, 15 (6), 1437-1445.
Candler, R. N. Duwel, A. Varghese, M. Chandorkar, S. A. Hopcroft, M. A. Park, W. T. Kim, B. Yama, G. Partridge, A. Lutz, M. Kenny, T. W. , Impact of geometry on thermoelastic dissipation in micromechanical resonant beams, Journal of Microelectromechanical Systems, 2006, 15 (4), 927-934.
Candler, R. N. Hopcroft, M. A. Kim, B. Park, W. T. Melamud, R. Agarwal, M. Yama, G. Partridge, A. Lutz, M. Kenny, T. W. , Long-term and accelerated life testing of a novel single-wafer vacuum encapsulation for MEMS resonators, Journal of Microelectromechanical Systems, 2006, 15 (6), 1446-1456.
W.-T. Park, A. Partridge, R. N. Candler, V. Ayanoor-Vitikkate, G. Yama, M. Lutz, and T. W. Kenny, Encapsulated Submillimeter Piezoresistive Accelerometers, Journal of Microelectromechanical Systems, 2006, 15 (3), 507-514.
A. Duwel, R. N. Candler, T. W. Kenny, and M. Varghese, Engineering MEMS Resonators with Low Thermoelastic Damping, Journal of Microelectromechanical Systems, 2006, 15 (6), 1437-1445.
R. N. Candler, M. Hopcroft, B. Kim, W.-T. Park, R. Melamud, M. Agarwal, G. Yama, A. Partridge, M. Lutz, T. W. Kenny, Long-Term and Accelerated Life Testing of a Novel Single-Wafer Vacuum Encapsulation for MEMS Resonators, Journal of Microelectromechanical Systems, 2006, 15 (6), 1446-1456.
Woo-Tae, Park Candler, R. N. Ayanoor-Vitikkate, V. Lutz, M. Partridge, A. Yama, G. Kenny, T. W. , Fully encapsulated sub-millimeter accelerometers, 18th IEEE International Conference on Micro Electro Mechanical Systems, 2005, volume (number), 347-350.
Candler, R. N. , Stuff most students never ask about grad school, IEEE Potentials, 2005, 24 (3), 4-10.
Candler, R. N. Park, W. T. Li, H. M. Yama, G. Partridge, A. Lutz, M. Kenny, T. W. , Single wafer encapsulation of MEMS devices, Ieee Transactions on Advanced Packaging, 2003, 26 (3), 227-232.